Item | ||||||
Mass Production | Try Run | |||||
Layers | 32 | 42 | ||||
Min line / space | 40/40um (1.6/1.6mil) | 35/35um (1.4/1.4mil) | ||||
Min. laser drill diameter | 70um (2.8mil) | 65um (2.6mil) | ||||
Aspect ratio of PTH | 16:1 | 18:1 | ||||
Min .core thincknetss(excluding copper) | 40um(1.6mil) | 30um(1.2mil) | ||||
Anylayer interconnection | 5+2+5 | 6+2+10 | ||||
Material | FR4, Megtron, Nelco, Rogers, Heavy Copper, etc. | |||||
Surface Finish | Lead-free HASL, ENIG, OSP, Immersion silver, Immersion tin, Flash gold, Gold finger plating, Selective hard gold plating, Peelable solder mask, Carbon ink |